SPTS ESC Refurbishment
-
Electrostatic Chuck (ESC)
Used in vacuum environments, the ESC is a core and critical component in IC manufacturing equipment, serving several key functions:
• Adsorbing and supporting wafers
• Controlling wafer surface temperature
• Acting as part of the RF systemESCs can be categorized into two types based on electrode design:
• Single-electrode: a single electrode covering the entire electrostatic chuck surface
• Dual-electrode: utilizing electric fields generated by positive and negative voltages to adsorb wafersCompared to single-electrode designs, dual-electrode ESCs offer higher adhesion force and more uniform electric field strength, enabling tight and even wafer attachment.
Part Number 716296
2022890
2028674
40040411FB325554
FB319730
FB321943
FB319626FB325554
FB319730
FB321943
FB319626Wafer Size 100/150/200 100/150/200 150/200/300 Application ICP Synapse/PVD Raiper/TSV HV ±4500 ±4500 ±4500 Chucking Force >4.5kg >4.5kg >4.5kg Top Dielectric layer Al2O3 Plate Al2O3 Plate Al2O3 Plate Electrode Dual Dual Dual Heating layer No No No -
Electrostatic Chuck (ESC)
Used in vacuum environments, the ESC is a core and critical component in IC manufacturing equipment, serving several key functions:
• Adsorbing and supporting wafers
• Controlling wafer surface temperature
• Acting as part of the RF system
Used in vacuum environments, the ESC is a core and critical component in IC manufacturing equipment, serving several key functions:
• Adsorbing and supporting wafers
• Controlling wafer surface temperature
• Acting as part of the RF system