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Precision Quartz And Ceramic Components
For Semiconductor Manufacturing
Service Industry
CNC Precision Machining
Five-axis cnc grinding center to achieve high-precision quartz, sapphire and advanced ceramics cylindrical surface, plane and complex profile grinding.
Per drawing
Dimensional Tolerance
By spec
Surface Roughness
Reviewed
Flatness
Core Processing Capability
Precision Cutting
Diamond wire saw and laser cutting system provides micron-level sectioning accuracy with extremely low kerf loss for ultra-thin quartz and sapphire substrates.
By Drawing
Cutting Accuracy
By Spec
Edge Cracking
Reviewed
Minimum Slice Thickness
Grinding And Polishing
Multi-stage grinding and polishing process to achieve sub-nano-scale surface finish, suitable for quartz windows, sapphire viewing windows and precision optical planes.
Per Drawing
Dimensional Tolerance
By spec
Surface Roughness
Reviewed
Flatness
Hot Processing
Hydrogen-oxygen flame welding to meet the helium leak detection air tightness standard, which is suitable for air tightness process components.
Per Drawing
Dimensional Tolerance
By Spec
Surface Roughness
Reviewed
Flatness
Semiconductor Data Overview
2022
Year Of Establishment
5
Production Line
10
Material Grade
ISO 9001
ISO 9001 Certification
Company Introduction
About Us
Wuxi Mashi Technology Co., Ltd. is a comprehensive enterprise specializing in the development and sales of semiconductor parts. It is located in Wuxi City, Jiangsu Province, the agglomeration area of China's semiconductor parts industry.
