CNC precision machining
5-axis CNC grinding and milling centers with ± 0.01mm dimensional tolerances and Ra 0.1 μm surface roughness on quartz, sapphire and advanced ceramics.
Quartz and Ceramics
Brittle non-metallic materials-fused silica, sapphire and engineering ceramics-is fundamentally different from metalworking. The brittleness, thermal sensitivity and chemical reactivity of materials to conventional coolants require special equipment, special tools and specific process parameters.
In Tucuan Semiconductor, CNC precision machining is our core competitiveness. Our grinding centers exclusively employ diamond abrasive wheels with an ultra-pure coolant system to prevent contamination of precision quartz and ceramic workpieces.
Process Capability
Long tool life-the service life on quartz is 10-20 times that of traditional abrasives
controlled chip formation-finer chips reduce subsurface damage
stable surface roughness-predictable Ra values over the life of the wheel
zero metal contamination-iron oxide contamination from steel bond free wheels
Applicable Materials
| Material | Machinability | Main Tool Requirements |
| natural fused silica | ★★★★☆ | resin bond diamond grinding wheel |
| synthetic fused silica | ★★★★☆ | resin bond diamond grinding wheel |
| Sapphire | ★★★☆ ☆ | metal bond diamond, fine grain size |
| Alumina (99.5%) | ★★★☆ ☆ | resin/metal bond diamond |
| silicon nitride | ★★★☆ ☆ | metal bond diamond |
| silicon carbide | ★★☆ ☆ ☆ | metal-bonded diamond, coarse-grained pre-ground |
| boron nitride | ★★★★★ | alloy or high speed steel tool can be |
| Specifications | Standard Level | precision level |
|---|---|---|
| outer diameter tolerance | ± 0.02mm | ± 0.01mm |
| inner hole tolerance | ± 0.03mm | ± 0.02mm |
| roundness | ± 0.01mm | ± 0.005mm |
| surface roughness | Ra 0.4 μm | Ra 0.1 μm |
| maximum outer diameter | 400mm | 300mm |
| maximum length | 2000mm | 1 |
Fused silica (hardness of about 600 hv) and engineering ceramics (hardness of 1000-2700 hv) are 2-5 times harder than hardened steel. Traditional abrasive grinding wheels (corundum, silicon carbide) wear rapidly, and there is a risk of abrasive particles contaminating the workpiece. The advantages of diamond grinding wheels are:
Only Use Diamond Tools?
CNC machining of all semiconductor grade components uses the following measures:
Cleanroom Compatible Processing
The outer diameter (OD) and inner bore (ID) grinding are performed on a CNC cylindrical grinder equipped with a diamond wheel.
Grinding Of Outer Circle And Inner Hole
Surface grinding adopts diamond bowl-shaped grinding wheel or sand tile; high precision flatness is realized by multi-pass grinding.
Surface Grinding and Lapping
| Specifications | Value |
|---|---|
| flatness | < 0.005mm (grinding)/ < 0.002mm (grinding) |
| parallelism (opposite surface) | < 0.003mm |
| surface roughness | Ra 0.4 μm (grinding)/ Ra 0.1 μm (grinding) |
| Maximum board size | 500 × 500mm |
5-axis CNC grinding can complete complex contours, chamfers, arcs and cones in a single clamping, thereby minimizing repositioning errors.
Contour Grinding (Profiling And Arc)
| Features | Capacity |
|---|---|
| contour arc radius (convex/concave) | minimum R 1mm |
| angle feature | ± 0.1 ° |
| complex contour accuracy | ±0.02 m |
Ultra-pure deionized water coolant-no cutting oil with residual hydrocarbon contamination
quartz special machine tools-avoid cross-contamination with ceramic or metal work pieces
closed processing unit-positive pressure filtered air to prevent air particle pollution
processing is completed, the parts are ultrasonically cleaned, rinsed with deionized water and wiped with IPA in our ISO 7 clean room.
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